Bob Vermillion receives Lifetime Achievement Award for Packaging Engineering Contributions to better
Tobyhanna Army Depot
9 May 2018
The National, Institute of Packaging, Handling & Logistics Engineers (NIPHLE) consisting of the US Army, US NAVY, USMC, DLA, USAF, DCMA and Industry, honored Bob Vermillion, CPP, Fellow, RMV Technology Group, LLC with the James A. Russell Award, the highest recognition given each year by NIPHLE to recognize the Lifetime Achievement of a member for advancements and innovations in the field of Packaging Engineering for protection of the Warfighter.
In 2015, RMV at NASA Ames, received the NIPHLE Corporate Award in support of the Warfighter.
Early in his career, Bob developed a static shielding MX Missile Shroud. Later, Bob assisted in the development of a CDM safe electrostatic discharge shielding paperboard technology that today is still widely used in aerospace & defense and the commercial sector.
When the USMC needed to insure protection of successful mountaineering equipment for deployment to Afghanistan, Vermillion accepted the challenge and recommended RFID tracking. Thereafter, Vermillion published a paper on ESD issues with RFIDs and packaging.
When a DoD prime required UAV protocols for NAVAIR deployment compliance, Vermillion’s leadership team received an Outstanding Past Performance in packaging engineering requirements specific to unmanned systems, including training for repackaging optics by military personnel from very harsh environments.
Years ago, Vermillion invented a patent protected Protective Containerboard for Electrostatic Discharge Sensitive Devices. Later, Bob pioneered several other materials that exhibited superior shielding and charge mitigation properties.
In 1996, Vermillion assisted the Pentium II Packaging Development Team in design of a package that successfully survived high voltage discharges in transport before product launch.
In 1999, one of Bob’s developments was NASA Mars Mission Approved.
In 2002, using one of Vermillion’s edge cutting developments and a new ICP Technology, Bob developed a corrosion free, ESD shielding and tamper proof long-term storage package design. Bob's innovative and cost effective, anti-counterfeit design placed 1st in the Institute of Packaging Professionals Ameristar Award competition for the USA. Hewlett Packard placed 2nd and 3rd; Motorola trailed in 4th place.
To understand the risk of corrugated containerboard Triboelectrification during air transport, winter and Santa Ana Wind conditions, Bob is the First to map differences between charge levels of Asia Pacific Cylinder Paperboard versus Fourdrinier linerboard used in the Americas, Europe and the United Kingdom at various relative humidity levels.
Vermillion’s innovation in R&D has led to developments with high performance liners, numerous material reformulations and proprietary Trade Secret RMV Test Methods for pre-launch testing on a Lunar or Mars environment.
Another of Bob’s Trade Secret ground breaking advancements include shake down testing of touch displays, electronic flight helmets, hand-held devices, flexible electronics (wearables) and Small Satellites (CubeSats).
For the 2010 NASA Quality Leadership Forum, Vermillion was First to Present and First to Publish on Suspect Counterfeit ESD & Packaging Materials in the Aerospace & Defense Supply Chain.
Since 2016, Bob is a Featured Speaker for GIDEP on Suspect Counterfeit Packaging & Materials for GIDEP.
Over the years, Bob’s efforts have led to implementation of countermeasures by some of the largest electronic USA based corporations, US Army DAC, NASA, DLA, NAVAIR and Space Science Laboratories at UC Berkeley.
Upon initial recommendation byMSFC, Bob presented at the 2016 NASA Academy of Aerospace Quality (AAQ) for successful CubeSat deployment in cooperation with Auburn University School of Engineering. In 2017, Bob was asked to join the NASA/Auburn AAQ group as an Expert Adviser. In 2018, Bob presented at the 2018 NASA QLF, Cape Canaveral, again by NASA invitation. Bob's topic, Successful CubeSat Deployment, based upon original research conducted in the ESD laboratory located onsite at NASA Ames, continues to innovate and contribute practical, safe and cost effective solutions for NASA and the Warfighter.